Darmstadt, 26 February - 2 March, 2023


Join and experience connected microscopy

Connect with ZEISS at MC 2023 in Darmstadt to explore the latest microscopy innovations and advancements through hands-on technology demonstrations and daily in-booth educational presentations.

Meet our experts to learn how ZEISS can help to advance research, achieve insights, and minimize time-to-result with the latest in our portfolio of light, confocal, electron/ion and X-ray microscopy solutions. Gain insights into connected microscopy from ZEISS. From data management to global collaboration, from application design to data analytics, you'll get answers on how to improve workflows, manage data and how to add context to your results.
The Microscopy Conference will host an extended exhibition, which will bring together manufacturers and suppliers in the field of microscopy. Latest developments and new applications will be highlighted during lunchtime lectures.

Darmstadt, 26 February - 2 March, 2023

Microscopy Conference Darmstadt

Connect the microscopic world

Schlossgraben 1
64283 Darmstadt

ZEISS Lunchtime Lectures | 12.45 - 1.45 PM

Feb 27, 2023 

In situ micromechanical testing for understanding deformation mechanisms: from micro pillar compression to high-throughput testing.
Dr. Subin Lee, Institute for Applied Materials, Karlsruhe Institute of Technology (KIT), Eggenstein-Leopoldshafen
Micro-mechanical testing inherently results in a stochastic behavior as the sample dimensions diminish close to characteristic lengths, for example, average dislocation spacing. Therefore, it is highly recommended to collect large enough data for statistical analysis. The bottleneck so far mostly has been the sample preparation which is usually done by Ga+ focused-ion beam milling. Alternatively, a femtosecond pulsed laser can fabricate large amounts of samples effectively with its fast milling rate, which is 4 to 5 orders of magnitude higher compared to that of Ga+ focused ion beam. However, the side effects of femtosecond laser ablation on the microstructure of materials have not yet been fully understood. In this talk, we will present the study of the surface structure changes after femtosecond laser patterning. Their effects on the microstructure and mechanical properties of single crystal Cu will be presented.

Room: Vanadium

Mar 1, 2023 

Neuroscience and beyond: What we learned from volume imaging by focused ion beam-scanning EM
Dr. Wiebke Möbius, Max Planck Institute for Multidisciplinary Sciences-City Campus, Göttingen
Visualization of 3D architectures in cells and tissues by volume EM has become a widely applied and important technique in life science. Here we will explain which sample preparation strategies were used and how the 3D data contributed to our understanding in different research projects ranging from cell biology to neuroscience. Our applications cover cryo- as well as room temperature FIB-SEM using the Crossbeam 540. Since our main focus of research is myelin biology, we will also show examples how volume EM became indispensable to understand pathology.

Room: Chromium

Mar 2, 2023

Recent developments in AI powered X-ray Microscopy
Dr. Ben Tordoff, Head of Materials Science, ZEISS Microscopy
Artificial intelligence is finding applications throughout materials science, instrumentation and beyond. The X-Ray microscope is also distinct in its design such that resolution is not a strong function of sample size in contrast to microCT. In this talk, the application of AI to tomographic reconstruction, image denoising and scale bridging of X-Ray microscopy data will be discussed using real world examples to show the benefits encompassing throughput and image quality improvements with profound implications for correlative, multiscale imaging workflows.

Room: Copernicum

  ZEISS Workshops | 2.30 - 3.30 PM

Feb 27, 2023

An integrated solution for multi-modal in situ experiments
Dr. Kenneth PNG, ZEISS Microscopy
Integration of a high temperature, in situ tensile stage with an analytical field emission scanning electron microscope that has an Oxford Instruments EBSD detector enables real time - high temperature - crystallographic analysis of microstructure as the material is deformed within the microscope. The crystallographic structure is revealed as the material is deformed and correlated with the stress – strain curve measurement. This fully automated solution applies a unique feature tracking function, auto focus and auto stigmation correction so that the image of the area of interest remains sharp and in the field of view as the material is deformed. This session demonstrates the performance, automation of the integrated in situ tensile stage with EBSD on a tensile sample at high temperature.

Room: 2.08 Platinum

Feb 28, 2023

Efficient access to deeply buried features by massive fs-laser ablation and correlative X-ray Microscopy to Crossbeam workflow
Dr. Carsten Waltenberg, ZEISS Microscopy
The discovery of structures deeply embedded in the sample using non-destructive X-ray tomography has for some time become a standard analytical method for many material systems. In order to make these deep-laying structures accessible for further, high-resolution analysis methods (e.g. 3D-tomography (including EDS if needed) or 2D-SIMS at cross the sectional surface) within a reasonable time frame, material removal using fs-laser ablation has proven effective. This session will show the correlative workflow between XRM and Crossbeam and the material removal using massive fs-laser ablation.

Room: 2.08 Platinum

Mar 1, 2023

Recent improvements and intuitive imaging workflows on the ZEISS Sigma Family
Dirk Döhler, ZEISS Microscopy
Fast and intuitive image acquisition is essential especially when dealing with sensitive, non-conductive samples. In addition, it is important to contextualize and evaluate the data obtained. The variable pressure mode is a valid measure to enable electron microscopy on such challenging samples. In this demonstration, the new nanoVP light mode of the Sigma family will be shown. Furthermore, a workflow will be presented that guides the process of image acquisition all the way to AI-based image segmentation.

Room: 2.08 Platinum

Exhibitors´ Presentations | Feb 27, 2023 | 4 - 6 PM

Automated in situ microscopy with the new Sigma 560 FESEM

Sebastian Krauß, Applications Development Engineer, ZEISS Microscopy