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Wissenschaftliche Veröffentlichungen zu Themen rund um Photomasken.
Arbeiten von ZEISS-Autoren und Gemeinschaftsprojekten
Publikationen, die von ZEISS SMS-Autoren oder gemeinsam mit anderen Unternehmen verfasst wurden, finden Sie nach Technologie und Konferenz geordnet. Downloads sind kostenfrei. Copyright 2022 Society of Photo Optical Instrumentation Engineers. Eine Druckversion oder elektronische Kopie darf nur für den persönlichen Gebrauch angefertigt werden. Die systematische Vervielfältigung und Verbreitung, die entgeltliche oder kommerzielle Vervielfältigung von Inhalten oder die Veränderung des Inhalts der Dokumente sind untersagt.
Nach Technologie geordnete Publikationen
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2019
Actinic metrology platform for defect review and mask qualification: flexibility and performance
Proceedings Volume 10957, Extreme Ultraviolet (EUV) Lithography X; 109570X (2019) https://doi.org/10.1117/12.2518596 Event: SPIE Advanced Lithography, 2019, San Jose, California, United StatesSEM AutoAnalysis for reduced turnaround time and to ensure repair quality of EUV photomasks
Proceedings Volume 11147, International Conference on Extreme Ultraviolet Lithography 2019; 111471G (2019) https://doi.org/10.1117/12.2538474 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States2018
AIMSTM EUV first insertion into the back end of the line of a mask shop: a crucial step enabling EUV production
Proceedings Volume 10810, Photomask Technology 2018; 108100S (2019) https://doi.org/10.1117/12.2503361 Event: SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018, Monterey, California, United StatesAIMSTM EUV tool platform: aerial image based qualification of EUV masks
Proceedings Volume 10810, Photomask Technology 2018; 108100V (2018) https://doi.org/10.1117/12.2501379 Event: SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018, Monterey, California, United States -
2019
Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance
Proceedings Volume 11148, Photomask Technology 2019; 1114811 (2019) https://doi.org/10.1117/12.2536270
Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United StatesThe impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
Proceedings Volume 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology; 111780R (2019) https://doi.org/10.1117/12.2535900 Event: Photomask Japan 2019, 2019, Yokohama, Japan2018
Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution
Proceedings Volume 10807, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology; 108070K (2018) https://doi.org/10.1117/12.2500086 Event: Photomask Japan 2018, 2018, Yokohama, Japan -
2019
Enhanced Wafer Overlay Residuals Control; Deep Sub-Nanometer at Sub-Millimeter Lateral Resolution
Proceedings Volume 11177, 35th European Mask and Lithography Conference (EMLC 2019); 111770J (2019) https://doi.org/10.1117/12.2535641 Event: 35th European Mask and Lithography Conference, 2019, Dresden, GermanyReduce Probability of Wafer Intra-Field Process (Printing) Defects for Logic & DRAM Applications
Proceedings Volume 11177, 35th European Mask and Lithography Conference (EMLC 2019); 1117712 (2019) https://doi.org/10.1117/12.2535686 Event: 35th European Mask and Lithography Conference, 2019, Dresden, GermanyImproving chip performance by photomask tuning: ultimate intra-field CD control as a major part of an overall excursion prevention strategy
Proceedings Volume 11148, Photomask Technology 2019; 111480L (2019) https://doi.org/10.1117/12.2536896 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States -
2021
Mask defect detection with hybrid deep learning network
Journal of Micro/Nanopatterning, Materials, and Metrology, 20(4), 041205 (2021). https://doi.org/10.1117/1.JMM.20.4.041205Pushing the limits of EUV mask repair: addressing sub-10 nm defects with the next generation e-beam-based mask repair tool
Journal of Micro/Nanopatterning, Materials, and Metrology,20(3), 031013 (2021). http://dx.doi.org/10.1117/1.JMM.20.3.0310132019
On the road to automated production workflows in the back end of line
Proceedings Volume 10775, 34th European Mask and Lithography Conference; 107750N (2018) https://doi.org/10.1117/12.2326908 Event: 34th European Mask and Lithography Conference, 2018, Grenoble, France
Nach Veranstaltung geordnete Publikationen
-
2019
Actinic metrology platform for defect review and mask qualification: flexibility and performance
Proceedings Volume 10957, Extreme Ultraviolet (EUV) Lithography X; 109570X (2019) https://doi.org/10.1117/12.2518596 Event: SPIEAdvanced Lithography, 2019, San Jose, California, United StatesImproving chip performance by photomask tuning: ultimate intra-field CD control as a major part of an overall excursion prevention strategy
Proceedings Volume 11148, Photomask Technology 2019; 111480L (2019) https://doi.org/10.1117/12.2536896 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United StatesWafer alignment mark placement accuracy impact on the layer-to-layer overlay performance
Proceedings Volume 11148, Photomask Technology 2019; 1114811 (2019) https://doi.org/10.1117/12.2536270 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United StatesSEM AutoAnalysis for reduced turnaround time and to ensure repair quality of EUV photomasks
Proceedings Volume 11147, International Conference on Extreme Ultraviolet Lithography 2019; 111471G (2019) https://doi.org/10.1117/12.2538474 Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United States2018
AIMSTM EUV first insertion into the back end of the line of a mask shop: a crucial step enabling EUV production
Proceedings Volume 10810, Photomask Technology 2018; 108100S (2019) https://doi.org/10.1117/12.2503361 Event: SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018, Monterey, California, United StatesAIMSTM EUV tool platform: aerial image based qualification of EUV masks
Proceedings Volume 10810, Photomask Technology 2018; 108100V (2018) https://doi.org/10.1117/12.2501379 Event: SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018, Monterey, California, United States -
2019
Enhanced Wafer Overlay Residuals Control; Deep Sub-Nanometer at Sub-Millimeter Lateral Resolution
Proceedings Volume 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII; 109592K (2019) https://doi.org/10.1117/12.2516362 Event: SPIE Advanced Lithography, 2019, San Jose, California, United States -
2019
Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance
Proceedings Volume 11148, Photomask Technology 2019; 1114811 (2019) https://doi.org/10.1117/12.2536270
Event: SPIE Photomask Technology + EUV Lithography, 2019, Monterey, California, United StatesThe impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
Proceedings Volume 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology; 111780R (2019) https://doi.org/10.1117/12.2535900 Event: Photomask Japan 2019, 2019, Yokohama, Japan2018
Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution
Proceedings Volume 10807, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology; 108070K (2018) https://doi.org/10.1117/12.2500086 Event: Photomask Japan 2018, 2018, Yokohama, Japan -
2019
Enhanced Wafer Overlay Residuals Control; Deep Sub-Nanometer at Sub-Millimeter Lateral Resolution
Proceedings Volume 11177, 35th European Mask and Lithography Conference (EMLC 2019); 111770J (2019) https://doi.org/10.1117/12.2535641 Event: 35th European Mask and Lithography Conference, 2019, Dresden, GermanyReduce Probability of Wafer Intra-Field Process (Printing) Defects for Logic & DRAM Applications
Proceedings Volume 11177, 35th European Mask and Lithography Conference (EMLC 2019); 1117712 (2019) https://doi.org/10.1117/12.2535686 Event: 35th European Mask and Lithography Conference, 2019, Dresden, Germany2018
On the road to automated production workflows in the back end of line
Proceedings Volume 10775, 34th European Mask and Lithography Conference; 107750N (2018) https://doi.org/10.1117/12.2326908 Event: 34th European Mask and Lithography Conference, 2018, Grenoble, France