Mask Qualification

Preventing defects from printing with state-of-the-art mask inspection

Even least defects in the layout of a single photomask can consign all chips on the exposed wafer resulting in enormous losses. That is why it is crucial to inspect all masks for defects, understand their impact on the photolithography process, and eliminate them before the mask is used in a stepper or scanner. The best way to reliably control quality at this stage is to optically emulate the photolithographic process using the Aerial Image Measurement. The AIMS™ system is the only scanner emulator covering all lithography techniques including Double Patterning, Source Mask Optimization (SMO) and Inverse Lithography.

AIMS™ 32-193i

Aerial Image Measurement for advanced 193 nm lithography techniques

AIMS™ 32-193i is a unique mask qualification system used in mask shops for advanced defect review, printability analysis and repair verification for all types of high-end photomasks.

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AIMS™ EUV

Verification of EUV masks

The EUV mask infrastructure is of key importance for a successful introduction of EUV lithography into volume production. In particular, for the production of defect free masks an actinic review of potential defect sites is required, AIMS™ EUV.

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