![Eine Mitarbeitende mit einer Photomaske im Reinraum bei ZEISS SMT]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wallpaperlonger.jpg/_jcr_content/renditions/original.image_file.100.100.219,0,1475,1256.file/wallpaperlonger.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wallpaperlonger.jpg/_jcr_content/renditions/original.image_file.360.360.219,0,1475,1256.file/wallpaperlonger.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wallpaperlonger.jpg/_jcr_content/renditions/original.image_file.768.768.219,0,1475,1256.file/wallpaperlonger.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wallpaperlonger.jpg/_jcr_content/renditions/original.image_file.1024.1024.219,0,1475,1256.file/wallpaperlonger.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wallpaperlonger.jpg/_jcr_content/renditions/original.image_file.1256.1256.219,0,1475,1256.file/wallpaperlonger.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wallpaperlonger.jpg/_jcr_content/renditions/original.image_file.1256.1256.219,0,1475,1256.file/wallpaperlonger.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wallpaperlonger.jpg/_jcr_content/renditions/original.image_file.1256.1256.219,0,1475,1256.file/wallpaperlonger.jpg"} "Photomaske ZEISS SMT Tuning System")
ZEISS ForTune Systeme
Überwinden die Grenzen der Lithographie
Wafer Fabs verlassen sich in hohem Maße auf Vorhersehbarkeit und Zuverlässigkeit. Das Erzielen hoher Erträge ist entscheidend, um Kunden von ihrer Leistungsfähigkeit zu überzeugen. Jede Prozessabweichung, die den Ertrag verringert, beeinträchtigt das Vertrauen des Kunden in die Leistungsfähigkeit und Zuverlässigkeit der Wafer Fab erheblich. ZEISS bietet eine innovative Lösung zur Vermeidung von Prozessabweichungen durch die Verbesserung der Intra-Field-CDU und des Wafer On-Product-Overlay (OPO).
![Tuning Vorgehen einer Fotomaske unter dem Mikroskop]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu1.jpg/_jcr_content/renditions/original.image_file.100.100.0,4,1600,1604.file/appbildneu1.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu1.jpg/_jcr_content/renditions/original.image_file.360.360.0,4,1600,1604.file/appbildneu1.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu1.jpg/_jcr_content/renditions/original.image_file.768.768.0,4,1600,1604.file/appbildneu1.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu1.jpg/_jcr_content/renditions/original.image_file.1024.1024.0,4,1600,1604.file/appbildneu1.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu1.jpg/_jcr_content/renditions/original.image_file.1280.1280.0,4,1600,1604.file/appbildneu1.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu1.jpg/_jcr_content/renditions/original.image_file.1440.1440.0,4,1600,1604.file/appbildneu1.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu1.jpg/_jcr_content/renditions/original.image_file.1600.1600.0,4,1600,1604.file/appbildneu1.jpg"} "ZEISS Tuning Photomaske")
![Tuning Vorgehen einer Fotomaske unter dem Mikroskop]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu2.jpg/_jcr_content/renditions/original.image_file.100.100.file/appbildneu2.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu2.jpg/_jcr_content/renditions/original.image_file.360.360.file/appbildneu2.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu2.jpg/_jcr_content/renditions/original.image_file.768.768.file/appbildneu2.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu2.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/appbildneu2.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu2.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/appbildneu2.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu2.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/appbildneu2.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/appbildneu2.jpg/_jcr_content/renditions/original./appbildneu2.jpg"} "ZEISS Maskentuning")
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ForTune
Intra-Field-Lösungen mit hoher lateraler Auflösung für CDU & OVL
Mit seinem neuesten optischen Design hebt ZEISS ForTune die beiden wichtigsten Tuning-Anwendungen in Bezug auf Effizienz, Genauigkeit und Durchsatz auf ein neues Niveau.
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ForTune EUV
Verbesserung des Wafer-Overlays für die EUV-Technologie
ZEISS ForTune EUV ist ein hochleistungsfähiges Maskentuning-System zur Verbesserung des Wafer-Overlays für die EUV-Technologie, das auf der Eingabe von Maskenregistrierung oder Wafer-Intra-Field-Overlay basiert.
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Digitale Lösungen
Für ForTune und ForTune EUV
Eine leistungsfähige Rechenplattform ermöglicht eine Steigerung der Produktivität und Zuverlässigkeit für schnelle Berechnungen.
![ZEISS ForTune system for photomasks]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune.jpg/_jcr_content/renditions/original.image_file.100.75.107,0,1814,1280.file/fortune.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune.jpg/_jcr_content/renditions/original.image_file.360.270.107,0,1814,1280.file/fortune.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune.jpg/_jcr_content/renditions/original.image_file.768.576.107,0,1814,1280.file/fortune.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune.jpg/_jcr_content/renditions/original.image_file.1024.768.107,0,1814,1280.file/fortune.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune.jpg/_jcr_content/renditions/original.image_file.1280.960.107,0,1814,1280.file/fortune.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune.jpg/_jcr_content/renditions/original.image_file.1440.1080.107,0,1814,1280.file/fortune.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune.jpg/_jcr_content/renditions/original.image_file.1707.1280.107,0,1814,1280.file/fortune.jpg"} "ZEISS ForTune")
![ZEISS ForTune EUV for photomasks]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune-euv.jpg/_jcr_content/renditions/original.image_file.100.75.67,0,1134,800.file/fortune-euv.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune-euv.jpg/_jcr_content/renditions/original.image_file.360.270.67,0,1134,800.file/fortune-euv.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune-euv.jpg/_jcr_content/renditions/original.image_file.768.576.67,0,1134,800.file/fortune-euv.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune-euv.jpg/_jcr_content/renditions/original.image_file.1024.768.67,0,1134,800.file/fortune-euv.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune-euv.jpg/_jcr_content/renditions/original.image_file.1067.800.67,0,1134,800.file/fortune-euv.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune-euv.jpg/_jcr_content/renditions/original.image_file.1067.800.67,0,1134,800.file/fortune-euv.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune-euv.jpg/_jcr_content/renditions/original.image_file.1067.800.67,0,1134,800.file/fortune-euv.jpg"} "ZEISS ForTune EUV")
![Digitale Lösung für Tuning Systeme von ZEISS]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/stagecontainer.jpg/_jcr_content/renditions/original.image_file.100.75.file/stagecontainer.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/stagecontainer.jpg/_jcr_content/renditions/original.image_file.360.270.file/stagecontainer.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/stagecontainer.jpg/_jcr_content/renditions/original.image_file.768.576.file/stagecontainer.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/stagecontainer.jpg/_jcr_content/renditions/original.image_file.1024.768.file/stagecontainer.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/stagecontainer.jpg/_jcr_content/renditions/original.image_file.1280.960.file/stagecontainer.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/stagecontainer.jpg/_jcr_content/renditions/original.image_file.1440.1080.file/stagecontainer.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/stagecontainer.jpg/_jcr_content/renditions/original./stagecontainer.jpg"} "ZEISS Digitale Lösung")
![Zahlreiche Mikrochips aus dem Halbleiterbereich]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wafer-image.jpg/_jcr_content/renditions/original.image_file.100.100.129,0,850,721.file/wafer-image.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wafer-image.jpg/_jcr_content/renditions/original.image_file.360.360.129,0,850,721.file/wafer-image.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wafer-image.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/wafer-image.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wafer-image.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/wafer-image.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wafer-image.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/wafer-image.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wafer-image.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/wafer-image.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/wafer-image.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/wafer-image.jpg"} "Mikrochips SMT")
Reduktion von Prozessdefekten
Durch Excursion Prevention mit ForTune
Abweichungen in der Strukturierung können durch Prozess- und Lithographieparameter wie Fokus, Masken-CDU und Dosis verursacht werden. Strukturierungsdefekte können dabei durch das Zusammenspiel mehrerer Lithographieparameter entstehen, selbst wenn die einzelnen Parameter innerhalb der Spezifikationen liegen.
Zur Reduzierung von Wafer-Intra-Field-Prozessdefekten ist die Excursion Prevention mit dem ZEISS ForTune System eine bewährte Strategie. Dies kann durch den Einsatz der CDC-Applikation von ForTune erreicht werden: Es ermöglicht die Vermeidung von Exkursionen bei geringem Aufwand und niedrigen Kosten in Wafer Fabs. Infolgedessen werden die Ertragsausfälle erheblich reduziert.
![Photomaske wird mit einem Laserstrahl bearbeitet]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune_opo_edited.png/_jcr_content/renditions/original.image_file.100.100.0,1,500,501.file/fortune_opo_edited.png","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune_opo_edited.png/_jcr_content/renditions/original.image_file.360.360.0,1,500,501.file/fortune_opo_edited.png","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune_opo_edited.png/_jcr_content/renditions/original.image_file.500.500.0,1,500,501.file/fortune_opo_edited.png","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune_opo_edited.png/_jcr_content/renditions/original.image_file.500.500.0,1,500,501.file/fortune_opo_edited.png","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune_opo_edited.png/_jcr_content/renditions/original.image_file.500.500.0,1,500,501.file/fortune_opo_edited.png","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune_opo_edited.png/_jcr_content/renditions/original.image_file.500.500.0,1,500,501.file/fortune_opo_edited.png","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/fortune_opo_edited.png/_jcr_content/renditions/original.image_file.500.500.0,1,500,501.file/fortune_opo_edited.png"} "Photomaske ZEISS SMT")
Verbessertes Wafer-On-Product-Overlay
Registration Control trägt zu einer besseren OPO für DUV und EUV bei
Das Wafer On-Product Overlay (OPO) ist ein weiterer limitierender Schlüsselparameter für die Chipleistung, der gut kontrolliert werden muss. Die wichtigsten beteiligten Parameter können als feldübergreifende und feldinterne Parameter kategorisiert werden. Beide können über den Scanner gesteuert werden. Allerdings ist die Intra-Field Overlay Auflösung des Scanner begrenzt und kann nur bis zu Polynomen dritter Ordnung entlang der Scanschlitz Richtung korrigiert werden. Diese Scanner-Beschränkung führt zu nicht korrigierbaren Fehlern (NCE) bei hohen Ordnungszahlen, die dazu führen, dass die OPO außerhalb der Spezifikation liegt. ForTune wandelt NCE in CE (Correctable Errors) um, was zu einem verbesserten Intra-Field-Beitrag führt. Dies trägt dazu bei, das Wafer On-Product Overlay sowohl für DUV- als auch für EUV-Masken zu reduzieren.
![Kleinste Strukturen auf einem Mikrochip der Halbleiterindustrie]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/maskstructure1heller.jpg/_jcr_content/renditions/original.image_file.100.100.129,0,850,721.file/maskstructure1heller.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/maskstructure1heller.jpg/_jcr_content/renditions/original.image_file.360.360.129,0,850,721.file/maskstructure1heller.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/maskstructure1heller.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/maskstructure1heller.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/maskstructure1heller.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/maskstructure1heller.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/maskstructure1heller.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/maskstructure1heller.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/maskstructure1heller.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/maskstructure1heller.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/maskstructure1heller.jpg/_jcr_content/renditions/original.image_file.721.721.129,0,850,721.file/maskstructure1heller.jpg"} "Halbleiter Mikrochips")
Verbessertes Mix and Match
ForTune EUV reduziert das Overlay zwischen DUV- und EUV-Masken sowie EUV und EUV-Ebenen
Ein High-End-Maskensatz besteht aus mehreren DUV-Masken und einigen EUV-Masken. Die verschiedenen Ebenen müssen genau übereinander gedruckt werden, um einen funktionalen und leistungsstarken Mikrochip zu erhalten.
Mit seiner RegC®-Funktionalität reduziert ForTune EUV den Intra-Field Anteil, was zu einem optimierten Wafer Mix Match Overlay (MMO) führt.
![ZEISS SMS Solutions Portfolio Broschüre]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/productrange.jpg/_jcr_content/renditions/original.image_file.100.56.0,0,1919,1080.file/productrange.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/productrange.jpg/_jcr_content/renditions/original.image_file.360.203.0,0,1919,1080.file/productrange.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/productrange.jpg/_jcr_content/renditions/original.image_file.768.432.0,0,1919,1080.file/productrange.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/productrange.jpg/_jcr_content/renditions/original.image_file.1024.576.0,0,1919,1080.file/productrange.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/productrange.jpg/_jcr_content/renditions/original.image_file.1280.720.0,0,1919,1080.file/productrange.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/productrange.jpg/_jcr_content/renditions/original.image_file.1440.810.0,0,1919,1080.file/productrange.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/productrange.jpg/_jcr_content/renditions/original.image_file.1919.1079.0,0,1919,1080.file/productrange.jpg"} "ZEISS SMS Solutions Portfolio Broschüre")
![ZEISS ForTune Solutions Broschüre]({"xsmall":"https://www.zeiss.de/content/dam/smt/products/sms/imag/zeiss-fortune-brochure-cover.jpg/_jcr_content/renditions/original.image_file.100.56.3,0,1914,1076.file/zeiss-fortune-brochure-cover.jpg","small":"https://www.zeiss.de/content/dam/smt/products/sms/imag/zeiss-fortune-brochure-cover.jpg/_jcr_content/renditions/original.image_file.360.203.3,0,1914,1076.file/zeiss-fortune-brochure-cover.jpg","medium":"https://www.zeiss.de/content/dam/smt/products/sms/imag/zeiss-fortune-brochure-cover.jpg/_jcr_content/renditions/original.image_file.768.432.3,0,1914,1076.file/zeiss-fortune-brochure-cover.jpg","large":"https://www.zeiss.de/content/dam/smt/products/sms/imag/zeiss-fortune-brochure-cover.jpg/_jcr_content/renditions/original.image_file.1024.576.3,0,1914,1076.file/zeiss-fortune-brochure-cover.jpg","xlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/zeiss-fortune-brochure-cover.jpg/_jcr_content/renditions/original.image_file.1280.720.3,0,1914,1076.file/zeiss-fortune-brochure-cover.jpg","xxlarge":"https://www.zeiss.de/content/dam/smt/products/sms/imag/zeiss-fortune-brochure-cover.jpg/_jcr_content/renditions/original.image_file.1440.810.3,0,1914,1076.file/zeiss-fortune-brochure-cover.jpg","max":"https://www.zeiss.de/content/dam/smt/products/sms/imag/zeiss-fortune-brochure-cover.jpg/_jcr_content/renditions/original.image_file.1911.1075.3,0,1914,1076.file/zeiss-fortune-brochure-cover.jpg"} "ZEISS ForTune Solutions Broschüre")