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12. Oktober 2026
ZEISS stärkt sein Advanced-Packaging-Portfolio mit Lösungen für die Inline-3D-Röntgeninspektion und Wafer-Formkontrolle
Pressemitteilung -
3 Min. Lesedauer
Semiconductor Manufacturing Technology
2. September 2026
ZEISS auf der SEMICON Taiwan 2026
Pressemitteilung -
4 Min. Lesedauer
Semiconductor Manufacturing Technology
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Finden Sie hier die neuesten Presseinformationen von ZEISS.
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![ZEISS NLX-100 System zur zerstörungsfreien Inspektion innerer Strukturen moderner Chip-Packages.]({"xsmall":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.100.56.24,0,1896,1053.file/zeiss-nlx_prev.jpg","small":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.360.203.24,0,1896,1053.file/zeiss-nlx_prev.jpg","medium":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.768.432.24,0,1896,1053.file/zeiss-nlx_prev.jpg","large":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.1024.576.24,0,1896,1053.file/zeiss-nlx_prev.jpg","xlarge":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.1280.720.24,0,1896,1053.file/zeiss-nlx_prev.jpg","xxlarge":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.1440.810.24,0,1896,1053.file/zeiss-nlx_prev.jpg","max":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.1872.1053.24,0,1896,1053.file/zeiss-nlx_prev.jpg"})
![ZEISS DUNE 100 zur Messung und Korrektur von Waferdeformationen in der Halbleiterfertigung.]({"xsmall":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.100.56.249,71,1721,899.file/zeiss_dune_prev.jpg","small":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.360.203.249,71,1721,899.file/zeiss_dune_prev.jpg","medium":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.768.432.249,71,1721,899.file/zeiss_dune_prev.jpg","large":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.1024.576.249,71,1721,899.file/zeiss_dune_prev.jpg","xlarge":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.1280.720.249,71,1721,899.file/zeiss_dune_prev.jpg","xxlarge":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.1440.810.249,71,1721,899.file/zeiss_dune_prev.jpg","max":"https://www.zeiss.de/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.1472.828.249,71,1721,899.file/zeiss_dune_prev.jpg"})